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Home > Ordnance Documents and other related manuals > > Figure 1-28. Circuit Board Mounting Bushings.
Figure 1-27. Optical Shroud And Window Assembly.
Alignment Bracket Assembly parts removal/replacement.

Troubleshooting ther AN/ GVS-5 Laser Observation Devise Test Set, TS-3620
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3-36. Bracket Mount removal/replacement.

Removal.  Remove the four sets of mounting hardware (77, 78,
79, and 80) and the mount (76).

Replacement.
Secure
the
bracket
mount
with
four
sets
of
mounting hardware.
3-37. Ground Terminal E1 removal/replacement.

Removal.
Remove the mounting hardware (82, 83, and 84) and
the terminal E1 (81).

Replacement.
Secure
the
terminal
E1
with
the
mounting
hardware.
3-38. Printed Circuit Board Mounting Bushing removal/replacement.

Removal.
Refer to figure 1-28.
--
Remove the A2 assembly (step 3-22) or the A3 assembly
(step 3-23).
--
Use  a  very  sharp  knife  to  cut  away  the  old  bonding
material  holding  the  mounting  bushing  to  the  printed
circuit board.  Pull the bushing out of its hole.
--
Carefully  scrape  away  the  residue  of  the  old  bonding
material.
Figure 1-28.
Circuit Board Mounting Bushings.

Replacement.
--
Use naphtha and soft tissue to clean the bushing contact
surface of the printed circuit board.
NOTE:
The two part sealant used for bonding after mixing does not
fully harden.
It will stay partially soft.
There is no
solvent for part one (base).  Xylene is the solvent for part
two (accelerator).
54
OD1716






Western Governors University

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